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中国研究人员绕过美国出口管制，在未使用ASML先进EUV光刻设备的情况下实现sub-3-nm半导体加工。
Ann Cao / SCMP — Tech:Chinese researchers achieve sub-3-nm semiconductor processing without advanced EUV lithography, circumventing US export controlsBreakthrough uses older lithog…
Breakthrough uses older lithography technology as ASML EUV tools remain blocked under US sanctions on chip equipment exports.